The EzLaze 3 Laser Cutting System is a valuable tool for semiconductor failure analysis, design verification and LCD repair. Able to be mounted on most major brands of FA microscope, the EzLaze3 allows the user to make precise cuts and selectively remove material on a microscopic scale.

New Wave's Advanced Beam Delivery System (ABDS) combines reliability with flexibility and allows the selectable-wavelength beam to be tailored to the material being worked and the cut required. The air-cooled architecture keeps size and weight to a minimum and makes the system maintenance-free.

U.S. Patent #. 5,611,946, 5,811,751, 5,963,364, 5,703,713 Japan Patent #. 3026362



EzLaze shown mounted
on a microscope option.

  Features

  • Selectable wavelengths allow cutting and machining of a wide range of materials
  • Uniform, repeatable cuts from 50µm x 50µm IR & green (with 50x objective) to 2µm x 2µm (with 100x objective)
  • Burst mode (5 Hz for 10 seconds followed by 20 second cool-down period) facilitates faster material removal
  • Intuitive operation from convenient Remote Control Panel with menu-based LCD display
  • Can be controlled from PC running New Wave Research LaserExec software
  • Panel-mounted HI/LO energy level switch allows precise control of energy level over a wide range while maintaining optimum beam characteristics
  • Easy installation, no costly maintenance and no toxic gases to handle

  Operation

The EzLaze is convenient to operate. All laser operations, including energy level, aperture size and wavelength are controlled from the system's Remote Control Panel. This minimizes the chance of disturbing a delicate microscope set-up through accidental contact. Alternatively, the system can be operated via PC.

Consistent with the New Wave Research system design philosophy, single wavelength systems can be easily upgraded to multi-wavelength systems.

  Multiple-Wavelength Advantages

Multiple-wavelengths offer design engineers, failure analysts and those involved in LCD repair the ability to quickly select the laser wavelength that most closely matches their application requirements.

For example, UV removes polyimide directly without causing damage to materials underneath. Silicon and GaAs are semi-transparent to IR energy so metal lines can be removed using IR, minimizing damage to the underlying silicon substrate. Green, the most widely used wavelength, is effective for cutting metals and removing oxide. Devices under test can contain several materials and require the use of multiple wavelengths to achieve the desired results.

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